Investigations of Infrared Desktop Reflow Oven with FPCB Substrate during Reflow Soldering Process
نویسندگان
چکیده
This paper presents the study of infrared (IR) reflow oven characteristics for suitable operating conditions flexible printed circuit board (FPCB) in soldering process. A computer-based model that imitates a real-time was developed with practical boundary conditions. Since radiation effect is dominant process, discrete ordinate (DO) selected to simulate effect. The experimental work acts as benchmark and profile set follow standards JSTD-020E. simulation has great consensus between data. It found temperature distribution inhomogeneous along phases. FPCB surface also higher than air during profile. An in-depth using approach reveals desktop dependent on several factors, namely fan speed, position, thickness. rotational generates an unsteady flow induces at different positions cavity. results are useful studying further improvements achieve uniformity within chamber.
منابع مشابه
No-Clean Reflow Process Implementation
ne of the corporate goals at AT&T is to eliminate chloroflurocarbons (CFCs) from its manufacturing operations by the end of 1994. Many alternatives have been implemented to meet this objective, including noclean wave soldering using low-solids flux, aqueous cleaning of water-soluble flux, aqueous cleaning with saponifiers and semiaqueous (terpene) cleaning. Part 1 of this article describes the ...
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ژورنال
عنوان ژورنال: Metals
سال: 2021
ISSN: ['2075-4701']
DOI: https://doi.org/10.3390/met11081155